Invention Grant
- Patent Title: Head mounted device
-
Application No.: US16143454Application Date: 2018-09-27
-
Publication No.: US10492556B1Publication Date: 2019-12-03
- Inventor: Chia-Feng Lee , Chang-Tse Lee , Kai-Wen Cheng , Wei-Lung Huang
- Applicant: Primax Electronics Ltd.
- Applicant Address: TW Taipei
- Assignee: PRIMAX ELECTRONICS LTD.
- Current Assignee: PRIMAX ELECTRONICS LTD.
- Current Assignee Address: TW Taipei
- Agent Kirton McConkie; Evan R. Witt
- Priority: TW107121535A 20180622
- Main IPC: H04R1/28
- IPC: H04R1/28 ; A42B3/04 ; F16B47/00 ; A42B3/30

Abstract:
A head mounted device for a helmet includes a connection module, a flexible bracket, a power supply seat and a function module. While the flexible bracket is moved relative to the connection module, a position of the power supply seat relative to the helmet is adjusted. While the function module is moved relative to the power supply seat, an orientation of the function unit is adjusted.
Public/Granted literature
- US20190387825A1 HEAD MOUNTED DEVICE Public/Granted day:2019-12-26
Information query
IPC分类: