A method for forming electrical connections between electrical conductors is provided. The method includes depositing an anisotropic conductive bonding material (AC bonding material) on a first plurality of electrical conductors, sandwiching the AC bonding material between the first plurality of electrical conductors and a second plurality of electrical conductors, providing first and second cushions formed of a thermally resistive and elastic material, and applying heat and pressure to the second cushion to form the AC bond between the first and second plurality of conductors.