An embodiment of the present invention provides a wiring substrate which allows bending of the wiring substrate to be carried out concurrently with reflow for mounting an electronic component to the wiring substrate. A component-mounted body (1) of an embodiment of the present invention includes a wiring substrate (10) and at least one bend assisting body (30) which is belt-like and formed on the wiring substrate (10). The wiring substrate (10) is bent so that a straight bending line is formed along a direction in which the at least one bend assisting body (30) extends. This forms, in the wiring substrate (10), a depressed portion (14) which can contain an IC chip (20).