Invention Grant
- Patent Title: Apparatuses and methods for integrated interleaved Reed-Solomon encoding and decoding
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Application No.: US15221806Application Date: 2016-07-28
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Publication No.: US10404282B2Publication Date: 2019-09-03
- Inventor: Yingquan Wu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H03M13/15
- IPC: H03M13/15 ; H03M13/29 ; H03M13/37
Abstract:
One example of integrated interleaved Reed-Solomon decoding can include computing a number of syndromes for each of a number of interleaves and correcting a number of erasures in each of the number of interleaves.
Public/Granted literature
- US20180034480A1 APPARATUSES AND METHODS FOR INTEGRATED INTERLEAVED REED-SOLOMON ENCODING AND DECODING Public/Granted day:2018-02-01
Information query
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