Invention Grant
- Patent Title: Structure, wiring module, and electronic apparatus
-
Application No.: US15544901Application Date: 2016-02-16
-
Publication No.: US10404047B2Publication Date: 2019-09-03
- Inventor: Tomoya Yano
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: JP2015-061471 20150324
- International Application: PCT/JP2016/054409 WO 20160216
- International Announcement: WO2016/152322 WO 20160929
- Main IPC: H02G3/30
- IPC: H02G3/30 ; H02G3/04 ; G02B6/44 ; H01B7/08 ; H01B11/22 ; H02G3/00 ; G02B17/02 ; G02B5/04

Abstract:
This structure includes a transparent member. The transparent member has a first surface and a second surface arranged to face each other, and allows light entering from the first surface to propagate toward the second surface by reflection. The transparent member has a plurality of slopes inclined with respect to the first surface, in an optical path between the first surface and the second surface.
Public/Granted literature
- US20180006442A1 STRUCTURE, WIRING MODULE, AND ELECTRONIC APPARATUS Public/Granted day:2018-01-04
Information query
IPC分类: