An interface module comprises a base defining a planar sliding surface for a male contact element, a connector housing formed of an electrically insulating material and movably received in a receptacle of the base, a contact received in the connector housing and arranged above the planar sliding surface, and a spring disposed opposite the contact in a direction perpendicular to the sliding surface. The connector housing has an insertion opening adapted to receive the male contact element. The contact has a contact leg projecting below a planar supporting surface for the male contact element. The spring is adapted to elastically abut against an underside of the male contact element in an assembled state. The male contact element is received within the insertion opening of the connector housing and the contact leg abuts a contact surface on an upper side of the male contact element in the assembled state.