Invention Grant
- Patent Title: Method for manufacturing organic electronic device and method for manufacturing sealing member
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Application No.: US15763559Application Date: 2016-08-04
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Publication No.: US10403858B2Publication Date: 2019-09-03
- Inventor: Masato Shakutsui , Masaya Shimogawara , Shinichi Morishima
- Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
- Applicant Address: JP Chuo-ku, Tokyo
- Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
- Current Assignee Address: JP Chuo-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-191883 20150929
- International Application: PCT/JP2016/072939 WO 20160804
- International Announcement: WO2017/056711 WO 20170406
- Main IPC: H01L51/56
- IPC: H01L51/56 ; H01L51/50 ; H05B33/04 ; H05B33/10 ; H01L51/00 ; H01L51/52
Abstract:
According to a method for manufacturing an organic electronic device, a sealing member (19) that includes a sealing substrate (15), an adhesive part (13) exhibiting adhesiveness and is provided on the sealing substrate (15), and a hygroscopic part (11) being a hygroscopic cured product provided on the adhesive part (13) is bonded to an organic electronic element (17).
Public/Granted literature
- US20180323408A1 METHOD FOR MANUFACTURING ORGANIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SEALING MEMBER Public/Granted day:2018-11-08
Information query
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