Invention Grant
- Patent Title: Fill fins for semiconductor devices
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Application No.: US15689466Application Date: 2017-08-29
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Publication No.: US10403714B2Publication Date: 2019-09-03
- Inventor: Kuo-Cheng Ching , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/088 ; H01L21/8234 ; H01L21/8238

Abstract:
A semiconductor device includes a semiconductor substrate, first and second device fins extending from the semiconductor substrate, and a fill fin disposed on the semiconductor substrate and between the first and second device fins, wherein the fill fin has an opening. The semiconductor device further includes a first gate structure extending continuously from a channel region of the first device fin to a channel region of the second device fin through the opening.
Public/Granted literature
- US20190067417A1 Fill Fins for Semiconductor Devices Public/Granted day:2019-02-28
Information query
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