Invention Grant
- Patent Title: Method for manufacturing semiconductor device
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Application No.: US15777681Application Date: 2016-11-17
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Publication No.: US10403709B2Publication Date: 2019-09-03
- Inventor: Youhei Oda , Tsuyoshi Fujiwara
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2016-010821 20160122
- International Application: PCT/JP2016/084092 WO 20161117
- International Announcement: WO2017/126207 WO 20170727
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L49/02 ; C23C14/06 ; C23C16/06 ; H01L21/822 ; H01L27/04 ; C23C16/34 ; C23C16/40 ; H01L21/285

Abstract:
Roughness is eliminated and planarization is achieved by a metal oxide film on a surface of a lower electrode. Consequently, damage on a capacitive film caused by the roughness of the lower electrode is reduced. Furthermore, physical damage on the capacitive film is reduced by forming a first layer of an upper electrode by, for example, CVD. Consequently, the damage on the capacitive film is suppressed, and the reliability of the capacitive film is improved. Furthermore, not by forming the whole upper electrode by the CVD or the like, but by forming a second layer by PCD or the like on the first layer, an increase in resistance of the upper electrode is suppressed as well.
Public/Granted literature
- US20180350897A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-12-06
Information query
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