The present technology relates to a semiconductor device that suppresses scattering dusts caused by dicing, chipping due to clogging, and further suppresses peel-off of an undercoat from a passivation film, thereby improving yields in manufacturing to realize cost reduction and a method for manufacturing the semiconductor device, a solid-state image pickup element, an image pickup device, and an electronic apparatus. In a step of exposing a pad by etching, when etching a lens material layer as an uppermost layer and a passivation layer, a pad portion and a blade region to be cut by a blade at the time of dicing are simultaneously etched, while a part of a region including both portions and a part therebetween or all the region on the lump, is simultaneously etched. Thereafter, in a layer of the semiconductor substrate under the lens material layer, only the pad portion is etched to expose the pad.