A semiconductor device comprising a plurality of semiconductor chips and a plurality of electric wirings. The plurality of semiconductor chips are stacked in a first direction, each semiconductor chip of the plurality of semiconductor chips including a plurality of conductive pads that are aligned in an aligning direction, orthogonal to the first direction. The plurality of semiconductor chips are stacked such that each semiconductor chip is shifted from an adjacent semiconductor chip of the plurality of semiconductor chips by a first predetermined interval in the aligning direction and shifted from the adjacent semiconductor chip by a second predetermined interval in a second direction orthogonal to both the first direction and the aligning direction. The plurality of electric wirings electrically connect the plurality of conductive pads of every other semiconductor chip of the plurality of semiconductor chips, respectively.