Invention Grant
- Patent Title: Electronic circuit package using composite magnetic sealing material
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Application No.: US15805150Application Date: 2017-11-07
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Publication No.: US10403582B2Publication Date: 2019-09-03
- Inventor: Kenichi Kawabata
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Young Law Firm, P.C.
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/552 ; H01L23/31 ; H01L23/538 ; H01L21/56 ; H01L21/48 ; H01L21/78 ; H01F1/147 ; C08K3/08 ; H01L23/29 ; H01L23/00
Abstract:
Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate, and a composite molding member having conductivity that covers the surface of the substrate so as to embed the electronic component and that is connected to the power supply pattern. The composite molding member includes a resin material and a first filler blended in the resin material and containing 32 to 39 wt. % of a metal material composed mainly of Ni in Fe.
Public/Granted literature
- US20180374799A1 ELECTRONIC CIRCUIT PACKAGE USING COMPOSITE MAGNETIC SEALING MATERIAL Public/Granted day:2018-12-27
Information query
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