Invention Grant
- Patent Title: Power module
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Application No.: US15544689Application Date: 2016-01-29
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Publication No.: US10403566B2Publication Date: 2019-09-03
- Inventor: Ronald Eisele , Frank Osterwald
- Applicant: DANFOSS SILICON POWER GMBH
- Applicant Address: DE Flensburg
- Assignee: Danfoss Silicon Power GmbH
- Current Assignee: Danfoss Silicon Power GmbH
- Current Assignee Address: DE Flensburg
- Agency: McCormick, Paulding & Huber LLP
- Priority: DE102015102041 20150212
- International Application: PCT/EP2016/051875 WO 20160129
- International Announcement: WO2016/128231 WO 20160818
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/29 ; H01L23/433 ; H01L23/31 ; H01L21/56
Abstract:
A power module (10) having a leadframe (20), a power semiconductor (30) arranged on the leadframe (20), a base plate (40) for dispersing heat generated by the power semiconductor (30) and a potting compound (50) surrounding the leadframe (20) and the power semiconductor (30), that physically connects the power semiconductor (30) and/or the leadframe (20) to the base plate (40).
Public/Granted literature
- US20170365541A1 POWER MODULE Public/Granted day:2017-12-21
Information query
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