Invention Grant
- Patent Title: Semiconductor device including a heat sink structure
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Application No.: US15381155Application Date: 2016-12-16
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Publication No.: US10403556B2Publication Date: 2019-09-03
- Inventor: Johannes Georg Laven , Peter Irsigler , Joachim Mahler , Guenther Ruhl , Hans-Joachim Schulze , Markus Zundel
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102015122804 20151223
- Main IPC: B82Y30/00
- IPC: B82Y30/00 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/40 ; H01L29/78 ; H01L23/367 ; H01L23/373 ; H01L23/427 ; H01L29/417 ; H01L29/423 ; H01L29/739

Abstract:
A semiconductor device includes a drift structure formed in a semiconductor body. The drift structure forms a first pn junction with a body zone of a transistor cell. A gate structure extends from a first surface of the semiconductor body into the drift structure. A heat sink structure extends from the first surface into the drift structure. A thermal conductivity of the heat sink structure is greater than a thermal conductivity of the gate structure and/or a thermal capacity of the heat sink structure is greater than a thermal capacity of the gate structure.
Public/Granted literature
- US20170186663A1 Semiconductor Device Including a Heat Sink Structure Public/Granted day:2017-06-29
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