- Patent Title: Semiconductor apparatus with inner wafer carrier buffer and method
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Application No.: US13623814Application Date: 2012-09-20
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Publication No.: US10403532B2Publication Date: 2019-09-03
- Inventor: Jason Shen , Wen-Yu Huang , Li-Jen Ko , Hsiang Yin Shen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsin-Chu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677
Abstract:
The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.
Public/Granted literature
- US20140075774A1 SEMICONDUCTOR APPARATUS WITH INNER WAFER CARRIER BUFFER AND METHOD Public/Granted day:2014-03-20
Information query
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