Invention Grant
- Patent Title: Semiconductor manufacturing apparatus with supporting columns and tables
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Application No.: US15915792Application Date: 2018-03-08
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Publication No.: US10403531B2Publication Date: 2019-09-03
- Inventor: Fumiki Aiso , Ryota Fujitsuka , Kensei Takahashi , Takayuki Matsui , Tomohisa Iino
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2017-167818 20170831
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/673 ; H01L21/687 ; H01L21/677 ; B25J11/00 ; B25J15/00 ; C23C16/44
Abstract:
In one embodiment, a semiconductor manufacturing apparatus includes a container to contain wafers, and supporting tables provided in the container so as to be stacked on one another, and each including a supporting face that comes into contact with a wafer to support the wafer. The apparatus further includes supporting columns to join the supporting tables together and provided at positions where the supporting columns are contained inside outer circumferences of the supporting tables. The apparatus further includes a gas feeder to feed a gas to the wafers on the supporting tables, and a gas discharger to discharge the gas fed to the wafers on the supporting tables. Each of the supporting tables includes a first upper face as the supporting face, and a second upper face provided so as to surround the first upper face at a level higher than a level of the first upper face.
Public/Granted literature
- US20190067066A1 SEMICONDUCTOR MANUFACTURING APPARATUS, WAFER CONVEYING APPARATUS AND WAFER CONVEYING METHOD Public/Granted day:2019-02-28
Information query
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