Invention Grant
- Patent Title: Conductive polypropylene-based foamed resin particles, method for production thereof, and polypropylene-based foamed molding article
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Application No.: US15438203Application Date: 2017-02-21
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Publication No.: US10403416B2Publication Date: 2019-09-03
- Inventor: Keishi Sato
- Applicant: Kaneka Corporation
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Osha Liang LLP
- Priority: JP2014-168827 20140821
- Main IPC: H01B1/24
- IPC: H01B1/24 ; C08J9/00 ; C08J9/18 ; C08L23/10 ; C08J9/232 ; C08J9/12 ; C08J9/14

Abstract:
Conductive polypropylene-based foamed resin particles foamed particles includes a resin composition containing 100 parts by weight of a polypropylene-based resin, 17.6 parts by weight to 33.4 parts by weight of conductive carbon black, and 0.1 parts by weight to 3.0 parts by weight of a water-soluble organic substance. The resin composition has a melting point (Tm) of 145° C. to 155° C., as measured by a differential scanning calorimetry (DSC) method, and has a temperature difference (ΔT) of 50° C. or more between the melting point (Tm) and a crystal melting start temperature (Tl) in a DSC differential scanning calorimetry (DSC) curve.
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