Invention Grant
- Patent Title: Systems and methods for reducing coupling noise between propagation lines for die size efficiency
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Application No.: US15976705Application Date: 2018-05-10
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Publication No.: US10403353B1Publication Date: 2019-09-03
- Inventor: Michael V. Ho , Ravi Kiran Kandikonda
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: G11C11/40
- IPC: G11C11/40 ; G11C11/4096 ; G11C11/408 ; G11C11/4076 ; G11C11/4093

Abstract:
Devices, systems, and methods for reducing noise couplings between propagation lines for size efficiency. In one embodiment, a memory device is provided, comprising a memory array and an input/output (I/O) circuit. The I/O circuit can include a first plurality of global data lines and a second plurality of global data lines. The second plurality of global data lines are directly interleaved between the first plurality of global date lines and are configured to shield the first plurality of global data lines. In some embodiments, the first plurality of global data lines are shorter in length than the second plurality of global data lines and are switched before the second plurality of global data lines are switched.
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