Invention Grant
- Patent Title: Multi-layer insulated wire and method of manufacturing the same
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Application No.: US16260433Application Date: 2019-01-29
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Publication No.: US10400174B2Publication Date: 2019-09-03
- Inventor: Tsuyoshi Miura , Tamotsu Kibe , Makoto Iwasaki , Yoshiaki Nakamura
- Applicant: Hitachi Metals, Ltd.
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2018-020156 20180207
- Main IPC: H01B7/295
- IPC: H01B7/295 ; C09K21/14 ; H01B3/30

Abstract:
In a multi-layer insulated wire including: a conductor; an inner layer formed in periphery of the conductor; and an outer layer formed in periphery of the inner layer, the inner layer is made of a resin composition containing a base polymer containing polyolefin as a main component, and the outer layer is made of a resin composition containing a base polymer containing polyolefin as a main component so as to contain 80 or more and 250 or less parts by mass of metallic hydroxide per 100 parts by mass of the base polymer. The multi-layer insulated wire having an expansion start temperature of the outer layer that is equal to or lower than 344° C. is used.
Public/Granted literature
- US20190241812A1 Multi-Layer Insulated Wire and Method of Manufacturing the Same Public/Granted day:2019-08-08
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