Described herein is a first method of forming a hole in a workpiece, having a first surface and a second surface opposite the first surface. The method includes forming a first hole, having a first diameter, in the workpiece by passing a first cutter through the workpiece from the first surface to the second surface. Additionally, the method includes forming a chamfer in the second surface of the workpiece concentric with the first hole using a second cutter. The chamfer has a second diameter larger than the first diameter. The method further includes forming a second hole, having a third diameter larger than the first diameter, in the workpiece concentric with the first hole by passing a third cutter through the workpiece from the first surface to the second surface.