Invention Grant
- Patent Title: Printed circuit board having EMI shielding function, method for manufacturing the same, and flat cable using the same
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Application No.: US16025641Application Date: 2018-07-02
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Publication No.: US10383212B2Publication Date: 2019-08-13
- Inventor: Kwang-Choon Chung , Byung Woong Moon
- Applicant: INKTEC CO., LTD.
- Applicant Address: KR Ansan-si, Gyeonggi-Do
- Assignee: INKTEC CO., LTD.
- Current Assignee: INKTEC CO., LTD.
- Current Assignee Address: KR Ansan-si, Gyeonggi-Do
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2017-0084415 20170703
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H01R12/79 ; H05K1/11 ; H01B7/08 ; H05K3/42

Abstract:
The present disclosure relates a printed circuit board having an EMI shielding function. In an example embodiment, the printed circuit board includes a substrate, a signal unit disposed on the substrate, a ground unit disposed in parallel with the signal unit, an insulation layer disposed above the substrate and covering the signal unit and the ground unit, an EMI shielding layer disposed on the insulation layer and under the substrate, respectively, and a shielding bridge passing through the substrate and the insulation layer at opposite sides of the signal unit and electrically connecting the EMI shielding layer disposed on the insulation layer to the EMI shielding layer disposed under the substrate.
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