Invention Grant
- Patent Title: High-frequency module
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Application No.: US16125886Application Date: 2018-09-10
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Publication No.: US10383210B2Publication Date: 2019-08-13
- Inventor: Takanori Uejima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-070550 20160331
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H04B1/525 ; H03H7/38 ; H04B1/04 ; H05K1/18 ; H05K9/00 ; H01L23/552 ; H01L23/31

Abstract:
A high-frequency module includes a branching circuit element, a multilayer substrate, and a shield conductor. The branching circuit element includes transmission and receiving terminals and is disposed on a surface of the multilayer substrate. The shield conductor is disposed on the side of the surface of the multilayer substrate and covers the branching circuit element. The transmission and receiving terminals are disposed with respect to the shield conductor such that a signal in at least a portion of the frequency band of a first signal, which is transmitted from the transmission terminal, is cancelled by a second signal at the receiving terminal.
Public/Granted literature
- US20190008032A1 HIGH-FREQUENCY MODULE Public/Granted day:2019-01-03
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