Invention Grant
- Patent Title: Wafer-based charged particle accelerator, wafer components, methods, and applications
-
Application No.: US16098537Application Date: 2017-05-04
-
Publication No.: US10383205B2Publication Date: 2019-08-13
- Inventor: Amit Lal , Thomas Schenkel , Arun Persaud , Qing Ji , Peter Seidl , Will Waldron , Serhan Ardanuc , Vinaya Kumar Kadayra Basavarajappa
- Applicant: CORNELL UNIVERSITY
- Applicant Address: US NY Ithaca
- Assignee: Cornell University
- Current Assignee: Cornell University
- Current Assignee Address: US NY Ithaca
- Agency: Perkins Coie LLP
- International Application: PCT/US2017/031029 WO 20170504
- International Announcement: WO2017/192834 WO 20171109
- Main IPC: H05H7/02
- IPC: H05H7/02 ; H05H7/22 ; H05H9/04

Abstract:
A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.
Public/Granted literature
- US20190159331A1 WAFER-BASED CHARGED PARTICLE ACCELERATOR, WAFER COMPONENTS, METHODS, AND APPLICATIONS Public/Granted day:2019-05-23
Information query
IPC分类: