A package includes a first layer on which a quartz crystal resonator element is mounted; a second layer that is joined to the first layer and on which a circuit element mounted; a third layer that is joined to a surface of the second layer that is opposite in direction to a surface of the second layer, on which the circuit element is mounted; a connection pad that is provided on the first layer; an external lateral surface terminal that is electrically connected to the connection pad; resonance element wiring that electrically connects the connection pad and the external lateral surface terminal to each other, in which the resonance element wiring is positioned between the third layer and the second layer, and includes terminal wiring that is connected to the external lateral surface terminal and interlayer wiring that connects the connection pad and the terminal wiring.