Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US15417944Application Date: 2017-01-27
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Publication No.: US10381460B2Publication Date: 2019-08-13
- Inventor: Yu Shin Ryu , Bo Seok Oh , Jin Yeong Son
- Applicant: MagnaChip Semiconductor, Ltd.
- Applicant Address: KR Cheongju-si
- Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee: MagnaChip Semiconductor, Ltd.
- Current Assignee Address: KR Cheongju-si
- Agency: NSIP Law
- Priority: KR10-2013-0120811 20131010
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/66 ; H01L29/423 ; H01L29/78 ; H01L29/10

Abstract:
A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a well region, a drain region and a source region disposed in the well region, a gate electrode disposed above the well region, a thin gate insulating layer and a thick gate insulating layer disposed under the gate electrode, the thick gate insulating layer being disclosed closer to the drain region than the thin gate insulating layer, and an extended drain junction region disposed below the gate electrode.
Public/Granted literature
- US20170141213A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2017-05-18
Information query
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