- Patent Title: Semiconductor device and method of forming the semiconductor device
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Application No.: US15859362Application Date: 2017-12-30
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Publication No.: US10381437B2Publication Date: 2019-08-13
- Inventor: Marc Adam Bergendahl , Gauri Karve , Fee Li Lie , Eric R. Miller , Robert Russell Robison , John Ryan Sporre , Sean Teehan
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: McGinn IP Law Group, PLLC
- Agent Vazken Alexander
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/786
Abstract:
A semiconductor device includes a fin structure including a cylindrical shape, an inner gate formed inside the fin structure, and an outer gate formed outside the fin structure and connected to the inner gate.
Public/Granted literature
- US20180122947A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE Public/Granted day:2018-05-03
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