Invention Grant
- Patent Title: Semiconductor device including resistor structure
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Application No.: US15850243Application Date: 2017-12-21
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Publication No.: US10381345B2Publication Date: 2019-08-13
- Inventor: Hong-sik Shin , Do-hyoung Kim , Doo-young Lee , Hyon-wook Ra , Seo-bum Lee , Won-hyuk Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2017-0012959 20170126
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/78 ; H01L49/02 ; H01L21/768 ; H01L23/522 ; H01L23/528 ; H01L23/532

Abstract:
Provided is a semiconductor device having an enhanced characteristic and a resistor structure satisfying a desired target resistor value of a resistor device. A semiconductor device includes: a lower interlayer insulating layer disposed on a substrate comprising a resistor area; a resistor structure comprising a resistor layer and an etch stop pattern sequentially stacked on the lower interlayer insulating layer of the resistor area; an upper interlayer insulating layer configured to cover the resistor structure and disposed on the lower interlayer insulating layer; a resistor contact structure configured to pass through the upper interlayer insulating layer and the etch stop pattern and contact the resistor layer; and a resistor contact spacer disposed between the upper interlayer insulating layer, the etch stop pattern, and the resistor contact structure.
Public/Granted literature
- US20180211952A1 SEMICONDUCTOR DEVICE INCLUDING RESISTOR STRUCTURE Public/Granted day:2018-07-26
Information query
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