Invention Grant
- Patent Title: High temperature drilling electronics
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Application No.: US15859068Application Date: 2017-12-29
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Publication No.: US10375826B2Publication Date: 2019-08-06
- Inventor: Sheng Zhan , Jinhai Zhao , Fengtao Hu , Herong Zheng
- Applicant: China Petroleum & Chemical Corporation , Sinopec Tech Houston, LLC.
- Applicant Address: CN Beijing
- Assignee: CHINA PETROLEUM & CHEMICAL CORPORATION
- Current Assignee: CHINA PETROLEUM & CHEMICAL CORPORATION
- Current Assignee Address: CN Beijing
- Agency: Novick, Kim & Lee, PLLC
- Agent Allen Xue
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/03 ; H05K1/18

Abstract:
A printed circuit board assembly (PCBA) for downhole applications has a printed circuit board (PCB) and a plurality of electronic components installed on the PCB. The PCB comprises a polyimide substrate, a lead-free surface finish, a plurality of traces, a plurality of surface mount pads, and a plurality of VIAs. The ratio between the width of one of the plurality of surface mount pads to the width of the trace connected thereto is 2 or less.
Public/Granted literature
- US20190208625A1 High Temperature Drilling Electronics Public/Granted day:2019-07-04
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