Invention Grant
- Patent Title: Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structures
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Application No.: US15928090Application Date: 2018-03-22
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Publication No.: US10375820B2Publication Date: 2019-08-06
- Inventor: Jinwoo Choi , Sungjun Chun , Jason L. Frankel , Paul R. Walling , Roger D. Weekly
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agent Joseph Petrokaitis; Amy J. Pattillo
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; G06F17/50
Abstract:
A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design.
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