Invention Grant
- Patent Title: Light receiving and emitting element module and sensor device
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Application No.: US15569595Application Date: 2016-04-27
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Publication No.: US10374116B2Publication Date: 2019-08-06
- Inventor: Naoki Fujimoto
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Procopio Cory Hargreaves and Savitch LLP
- Priority: JP2015-090056 20150427
- International Application: PCT/JP2016/063219 WO 20160427
- International Announcement: WO2016/175246 WO 20161103
- Main IPC: H01L31/12
- IPC: H01L31/12 ; G01N21/17 ; H01L31/0216 ; H01L31/0232 ; H01L33/58 ; G01S17/02 ; H01L25/16 ; H01L31/0203 ; H01L31/173 ; G01S7/481
Abstract:
A light receiving and emitting element module includes a wiring substrate; a light emitting element and a light receiving element which are disposed on the wiring substrate; and a lens member having a lens portion, a support portion configured to support the lens portion disposed above the light emitting element and the light receiving element and a column disposed on a lower surface of the support portion, wherein a tip end of the column is in contact with an upper surface of the wiring substrate.
Public/Granted literature
- US20180301585A1 LIGHT RECEIVING AND EMITTING ELEMENT MODULE AND SENSOR DEVICE Public/Granted day:2018-10-18
Information query
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