Invention Grant
- Patent Title: Fin and shallow trench isolation replacement to prevent gate collapse
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Application No.: US15646349Application Date: 2017-07-11
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Publication No.: US10374066B2Publication Date: 2019-08-06
- Inventor: Soon-Cheon Seo
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Fleit Gibbons Gutman Bongini Bianco PL
- Agent Thomas S. Grzesik
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/8234 ; H01L27/088 ; H01L29/06

Abstract:
A semiconductor structure and a method for fabricating the same. The structure includes a substrate, active fin structures, and non-active fin structures. The structure further includes isolation regions in contact with the active fin structures, and isolation regions in contact with the non-active fin structures. A first gate structure is in contact with the active fin structures and the isolation regions that are in contact with the active fin structures. A second gate structure is in contact with the non-active fin structures. The method includes forming an isolation region between fin structures. A mask is formed over active fin structures and dummy fin structures are then removed to form a plurality of trenches between the isolation regions. A nitride-based layer is formed in contact with isolation regions corresponding to the dummy fin structures. The nitride-based layer forms a non-active fin structure within each trench of the trenches.
Public/Granted literature
- US20190019877A1 FIN AND SHALLOW TRENCH ISOLATION REPLACEMENT TO PREVENT GATE COLLAPSE Public/Granted day:2019-01-17
Information query
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