Invention Grant
- Patent Title: FinFET and manufacturing method of the same
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Application No.: US16167554Application Date: 2018-10-23
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Publication No.: US10373954B2Publication Date: 2019-08-06
- Inventor: Ta-Hsun Yeh , Cheng-Wei Luo , Hsiao-Tsung Yen , Yuh-Sheng Jean
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee: REALTEK SEMICONDUCTOR CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., LLC
- Priority: TW105120341A 20160628
- Main IPC: H01L27/08
- IPC: H01L27/08 ; H01L27/088 ; H01L21/306 ; H01L21/8234 ; H01L29/08 ; H01L29/78 ; H01L29/66 ; H01L29/06

Abstract:
A FinFET that includes a semiconductor substrate that has insulating areas, a fin structure, a gate dielectric layer, a gate electrode structure, a drain structure and a source structure is provided. The fin structure is disposed to extend on the semiconductor substrate between two insulating areas. The gate dielectric layer is disposed to extend across two sides of the fin structure. The gate electrode structure is disposed on the gate dielectric layer. The drain structure is disposed at a first side of the gate electrode structure and has a first resistance relative to the gate electrode. The source structure is disposed at a second side of the gate electrode structure and has a second resistance relative to the gate electrode. The first resistance is larger than the second resistance.
Public/Granted literature
- US20190057965A1 FINFET AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2019-02-21
Information query
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