Invention Grant
- Patent Title: Semiconductor device packages
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Application No.: US15222820Application Date: 2016-07-28
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Publication No.: US10373916B2Publication Date: 2019-08-06
- Inventor: Ji-Min Lin , Ming-Wen Liao , Chun-Ying Huang
- Applicant: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
- Current Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L23/31 ; H01L23/64
Abstract:
A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.
Public/Granted literature
- US20180033736A1 SEMICONDUCTOR DEVICE PACKAGES Public/Granted day:2018-02-01
Information query
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