Invention Grant
- Patent Title: Semiconductor module using lead frame for power and control terminals and both having asymmetric or inhomogenous configuration
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Application No.: US15969807Application Date: 2018-05-03
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Publication No.: US10373899B2Publication Date: 2019-08-06
- Inventor: Hongbo Zhang , Shogo Shibata
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2017-246383 20171222
- Main IPC: H01L23/50
- IPC: H01L23/50 ; H01L23/495 ; H01L25/18 ; H01L23/367 ; H01L23/31 ; H01L29/16 ; H01L29/20
Abstract:
A semiconductor module includes: a semiconductor chip; a package sealing the semiconductor chip; and a plurality of terminals connected to the semiconductor chip and protruding from the package, wherein the plurality of terminals includes a plurality of first terminals arranged side by side at a first pitch, and a plurality of second terminals arranged side by side at a second pitch, each terminal has a base portion, a tip portion narrower than the base portion, and a connection portion connecting the base portion and the tip portion, the connection portions of the plurality of first terminals are right-angled, and the connection portions of the plurality of second terminals are arc-shaped.
Public/Granted literature
Information query
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