Invention Grant
- Patent Title: Composition and method used for chemical mechanical planarization of metals
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Application No.: US14947711Application Date: 2015-11-20
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Publication No.: US10373842B2Publication Date: 2019-08-06
- Inventor: Song Y. Chang , Mark Evans , Dnyanesh Chandrakant Tamboli , Stephen W. Hymes
- Applicant: Versum Materials US, LLC
- Applicant Address: US AZ Tempe
- Assignee: VERSUM MATERIALS US, LLC
- Current Assignee: VERSUM MATERIALS US, LLC
- Current Assignee Address: US AZ Tempe
- Agent Lina Yang
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/321 ; C09G1/02 ; C09K3/14 ; H01L21/768 ; B24B37/04
Abstract:
Compositions for use in CMP processing and methods of CMP processing. The composition utilizes low levels of particulate material, in combination with at least one amino acid, at least one oxidizer, and water to remove a metal layer such as one containing copper to a stop layer with high selectivity.
Public/Granted literature
- US20170372918A9 Composition and Method Used for Chemical Mechanical Planarization of Metals Public/Granted day:2017-12-28
Information query
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