Invention Grant
- Patent Title: Method of lateral oxidation of nFET and pFET high-K gate stacks
-
Application No.: US15892884Application Date: 2018-02-09
-
Publication No.: US10373835B2Publication Date: 2019-08-06
- Inventor: Takashi Ando , Robert H. Dennard , Martin M. Frank
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L29/40 ; H01L29/51 ; H01L21/8234 ; H01L21/8238 ; H01L29/66 ; H01L21/02 ; H01L27/092 ; H01L29/49 ; H01L29/78

Abstract:
A method for fabricating a semiconductor circuit includes obtaining a semiconductor structure having a gate stack of material layers including a high-k dielectric layer; oxidizing in a lateral manner the high-k dielectric layer, such that oxygen content of the high-k dielectric layer is increased first at the sidewalls of the high-k dielectric layer; and completing fabrication of a n-type field effect transistor from the gate stack after laterally oxidizing the high-k dielectric layer of the gate stack.
Public/Granted literature
- US20180174847A1 METHOD OF LATERAL OXIDATION OF NFET AND PFET HIGH-K GATE STACKS Public/Granted day:2018-06-21
Information query
IPC分类: