Invention Grant
- Patent Title: Semiconductor modules
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Application No.: US15638906Application Date: 2017-06-30
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Publication No.: US10373658B2Publication Date: 2019-08-06
- Inventor: Sang Jin Byeon
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Main IPC: G11C7/10
- IPC: G11C7/10 ; G11C8/04 ; H01L31/0203 ; H05K1/14 ; G11C5/04 ; G11C8/12 ; G11C11/00
Abstract:
A semiconductor module may include a host, a first semiconductor device, and a second semiconductor device. The first host line may be connected to the first and second semiconductor device or devices, according to a set mode.
Public/Granted literature
- US20190005992A1 SEMICONDUCTOR MODULES Public/Granted day:2019-01-03
Information query
