Invention Grant
- Patent Title: Blocking/deblocking resin systems for use as a “co-cure-ply” in the fabrication of large-scale composite structure
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Application No.: US15274147Application Date: 2016-09-23
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Publication No.: US10369767B2Publication Date: 2019-08-06
- Inventor: Frank L. Palmieri , John W. Connell , Christopher J. Wohl, Jr.
- Applicant: U.S.A. as represented by the Administrator of the National Aeronautics and Space Administration
- Applicant Address: US DC Washington
- Assignee: United States of America as represented by the Administrator of NASA
- Current Assignee: United States of America as represented by the Administrator of NASA
- Current Assignee Address: US DC Washington
- Agent Jennifer L. Riley; Robin W. Edwards; Mark P. Dvorscak
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B29C70/30 ; B29C65/00 ; B29C65/48 ; B29C65/50 ; C09J5/06 ; B29C65/02 ; B32B27/34 ; B29C65/14
Abstract:
A method for bonding composite structures which includes providing a first and second composite substrate and coupling a co-cure prepreg tape having chemically protected polymerizable functional groups onto a surface of both the first and second composite substrates. The first and second composite substrates are then cured to the co-cure prepreg tape at a first temperature to form a co-cure prepreg tape portion where the first and second composite substrates are fully cured and the co-cure prepreg tape is partially cured. The co-cure prepreg tape portion of the first composite substrate is then coupled to the co-cure prepreg tape portion of the second composite substrate and a deprotection initiator is applied to facilitate deprotection of the chemically protected polymerizable functional groups and cure the co-cure prepreg tape portion of the first and second composite substrates to form a single covalently bonded composite structure.
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