Invention Grant
- Patent Title: Die clamp assembly for a press machine having a position sensing apparatus and method of operating a press machine
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Application No.: US14705596Application Date: 2015-05-06
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Publication No.: US10369614B2Publication Date: 2019-08-06
- Inventor: Robert Daniel Anderzack
- Applicant: HONDA MOTOR CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Armstrong Teasdale LLP
- Main IPC: B21D37/14
- IPC: B21D37/14
Abstract:
A die clamp assembly for a press machine having a first die includes a die clamp configured to couple the first die to the press machine and a position sensing apparatus coupled to the die clamp. The position sensing apparatus being configured to sense proximity of the die clamp assembly to a sensing face of the first die.
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