Invention Grant
- Patent Title: Electromagnetic shield for rearview assembly
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Application No.: US15800240Application Date: 2017-11-01
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Publication No.: US10342167B2Publication Date: 2019-07-02
- Inventor: David J. Bouwkamp
- Applicant: Gentex Corporation
- Applicant Address: US MI Zeeland
- Assignee: GENTEX CORPORATION
- Current Assignee: GENTEX CORPORATION
- Current Assignee Address: US MI Zeeland
- Agency: Price Heneveld LLP
- Agent Bradley D. Johnson
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H05K9/00 ; B60R1/08 ; G02B5/08 ; G02F1/153 ; G02F1/157 ; H05K7/20 ; B60R1/04 ; B60R1/12 ; G02F1/15
Abstract:
A rearview assembly having a circuit board. A grounded heat sink is proximate the circuit board. A thermal pad is disposed between and in abutting contact with the circuit board and the grounded heat sink. An electromagnetic shield includes a plurality of spring tabs disposed about a periphery of the electromagnetic shield.
Public/Granted literature
- US20180124958A1 ELECTROMAGNETIC SHIELD FOR REARVIEW ASSEMBLY Public/Granted day:2018-05-03
Information query
IPC分类:
