- Patent Title: Production method for printed wiring board having dielectric layer
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Application No.: US15773373Application Date: 2016-11-18
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Publication No.: US10342143B2Publication Date: 2019-07-02
- Inventor: Toshiyuki Shimizu , Toshifumi Matsushima , Yoshihiro Yoneda
- Applicant: Mitsui Mining & Smelting Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: MITSUI MINNG & SMELTING CO., LTD.
- Current Assignee: MITSUI MINNG & SMELTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Young & Thompson
- Priority: WOPCT/JP2015/082627 20151119
- International Application: PCT/JP2016/084204 WO 20161118
- International Announcement: WO2017/086418 WO 20170526
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/00 ; H05K3/46 ; B32B15/08 ; B32B37/26 ; H05K1/02 ; H05K1/16

Abstract:
A production method includes: preparing a metal clad laminate including a dielectric layer≤30 μm thick, a first metal foil on a first surface of the dielectric layer, a second metal foil on a second surface of the dielectric layer, first and second carriers on the metal foil via a releasable layer; arranging the pair of metal clad laminates on a resin substrate so the first carrier of each metal clad laminate faces the resin substrate on each surface of the resin substrate; releasing the second carrier from a laminated member to expose the second metal foil; forming a pattern on the second metal foil; arranging an insulating layer on the pattern and arranging a metal layer on the insulating layer; and separating the first carrier and the first metal foil from each other. The dielectric layer has a strain energy at break of 1.8 MJ or less.
Public/Granted literature
- US20180332721A1 PRODUCTION METHOD FOR PRINTED WIRING BOARD HAVING DIELECTRIC LAYER Public/Granted day:2018-11-15
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