Invention Grant
- Patent Title: Fingerprint module, method for manufacturing the fingerprint module, and mobile terminal
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Application No.: US15953823Application Date: 2018-04-16
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Publication No.: US10342137B2Publication Date: 2019-07-02
- Inventor: Wenzhen Zhang
- Applicant: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Applicant Address: CN Dongguan
- Assignee: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Current Assignee: Guangdong Oppo Mobile Telecommunications Corp., Ltd.
- Current Assignee Address: CN Dongguan
- Agency: Young Basile Hanlon & MacFarlane, P.C.
- Priority: CN201610675359 20160816; CN201620888908U 20160816
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H05K1/14 ; H04M1/02 ; G06K9/00 ; H05K1/02 ; H05K3/30 ; H05K3/36 ; H05K5/03 ; G06F1/16
Abstract:
A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. The cover plate defines an assembling region. The fingerprint chip is fixed in the assembling region and has a plurality of pads. The intermediate board is bonded to a surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip to increase a bonding force between the fingerprint chip and the cover plate, so that there is a firm bonding between the fingerprint chip and the cover plate. The fingerprint chip is electrically connected to the intermediate board via the pads. The circuit board is electrically connected to the fingerprint chip via the intermediate board. The pads are connected to the circuit board via different wires to ensure effective transmission of electrical signals of the fingerprint chip.
Public/Granted literature
- US20180235088A1 Fingerprint Module, Method for Manufacturing the Fingerprint Module, and Mobile Terminal Public/Granted day:2018-08-16
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