Invention Grant
- Patent Title: Multilayer substrate
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Application No.: US16239562Application Date: 2019-01-04
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Publication No.: US10342125B2Publication Date: 2019-07-02
- Inventor: Takahiro Baba
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2016-151892 20160802; JP2017-076688 20170407
- Main IPC: H05K1/05
- IPC: H05K1/05 ; H05K1/02 ; H05K3/46 ; H05K1/16 ; H01F17/00 ; H05K3/00

Abstract:
A multilayer substrate includes a laminate, signal conductors, and external connection conductors. The signal conductors are at different positions in a lamination direction of the laminate. The external connection conductors are provided on a back surface of the laminate. A first signal conductor is connected at one end to one of the external connection conductors by a first wiring conductor. A second signal conductor is connected at one end to one of the external connection conductors by a second wiring conductor. The first signal conductor is closer to the back surface than the second signal conductor. The first wiring conductor includes wiring adjusting conductors each having a length corresponding to a distance difference in the lamination direction between the first and second signal conductors.
Public/Granted literature
- US20190141831A1 MULTILAYER SUBSTRATE Public/Granted day:2019-05-09
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