Invention Grant
- Patent Title: Distributed transistor-based power supply for supplying heat to a structure
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Application No.: US13733930Application Date: 2013-01-04
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Publication No.: US10342074B2Publication Date: 2019-07-02
- Inventor: William Preston Geren , Stephen Moore , Robert J. Miller , Mark Negley , Scott D. Billings
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: THE BOEING COMPANY
- Current Assignee: THE BOEING COMPANY
- Current Assignee Address: US IL Chicago
- Agency: Patterson + Sheridan, LLP
- Main IPC: H05B6/04
- IPC: H05B6/04 ; H05B6/06 ; H05B6/24 ; H05B6/10

Abstract:
A heating system includes a structure to be heated, and a heating apparatus disposed to heat the structure. The heating apparatus includes a housing member, a plurality of resonant frequency power sources, and a plurality of associated controls. The plurality of resonant frequency power sources are attached to the housing member. The plurality of associated controllers is configured to separately operate the plurality of resonant frequency power sources at resonant frequencies matching heating requirements of the structure.
Public/Granted literature
- US20140190954A1 DISTRIBUTED TRANSISTOR-BASED POWER SUPPLY FOR SUPPLYING HEAT TO A STRUCTURE Public/Granted day:2014-07-10
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