Invention Grant
- Patent Title: Passive radiator assembly
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Application No.: US15563860Application Date: 2015-04-02
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Publication No.: US10341763B2Publication Date: 2019-07-02
- Inventor: Shengbo Li , An Duc Nguyen
- Applicant: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Applicant Address: US CT Stamford
- Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Current Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
- Current Assignee Address: US CT Stamford
- Agency: Brooks Kushman P.C.
- International Application: PCT/US2015/024072 WO 20150402
- International Announcement: WO2016/160020 WO 20161006
- Main IPC: H04R1/28
- IPC: H04R1/28

Abstract:
A passive radiator assembly for a loudspeaker system comprising: a pair of passive radiators including a first and a second passive radiator; a frame having a first, a second and a third opening wherein the first and second opening are located on parallel sides of the frame, respectively, wherein the first and the second passive radiator are mounted into the first and second opening of the parallel sides of the frame, respectively, so as to oppose each other at a predetermined distance.
Public/Granted literature
- US20180077486A1 DESIGN OF A PASSIVE RADIATOR ASSEMBLY Public/Granted day:2018-03-15
Information query
IPC分类: