Invention Grant
- Patent Title: Liquid ejecting apparatus and circuit board
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Application No.: US15832899Application Date: 2017-12-06
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Publication No.: US10340815B2Publication Date: 2019-07-02
- Inventor: Koji Kitazawa , Dai Nozawa , Toru Kashimura
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2016-248824 20161222
- Main IPC: B41J2/045
- IPC: B41J2/045 ; H02M7/483

Abstract:
A liquid ejecting apparatus includes a first ejecting section that includes a first drive element and ejects liquid by driving the first drive element, a first drive circuit that includes a first transistor and outputs a first drive signal to the first drive element, a second drive circuit that includes a second transistor and outputs a second drive signal to the first drive element, a circuit substrate on which the first drive circuit and the second drive circuit are mounted. The first drive circuit is mounted on a first surface of the circuit substrate, and the second drive circuit is mounted on a second surface of the circuit substrate, and the first transistor and the second transistor are disposed at position that do not overlap one another in plan view of the circuit substrate.
Public/Granted literature
- US20180183352A1 LIQUID EJECTING APPARATUS AND CIRCUIT BOARD Public/Granted day:2018-06-28
Information query
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