Invention Grant
- Patent Title: Electronic device
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Application No.: US15834326Application Date: 2017-12-07
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Publication No.: US10340614B2Publication Date: 2019-07-02
- Inventor: Hirotaka Fukui
- Applicant: TOYODA GOSEI CO., LTD.
- Applicant Address: JP Aichi-pref.
- Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee: TOYODA GOSEI CO., LTD.
- Current Assignee Address: JP Aichi-pref.
- Agency: Posz Law Group, PLC
- Priority: JP2016-243618 20161215
- Main IPC: H01R12/57
- IPC: H01R12/57 ; B60Q3/00 ; H01R12/72 ; F21V23/06 ; F21V19/00 ; F21V23/04 ; H01R107/00

Abstract:
An electronic device includes: a substrate; a housing which covers the substrate; a conductive pin mounted on one edge portion of the substrate. The conductive pin projects from the substrate along a plane of the substrate, the conductive pin includes a projection portion and a soldered portion which is soldered to the substrate, and the soldered portion includes a conducting portion which is electrically conduction with a circuit wiring of the substrate.
Public/Granted literature
- US20180175524A1 ELECTRONIC DEVICE Public/Granted day:2018-06-21
Information query
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