A stacked III-V semiconductor diode having an n+-layer with a dopant concentration of at least 1019 N/cm3, an n−-layer with a dopant concentration of 1012-1016 N/cm3, a layer thickness of 10-300 microns, a p+-layer with a dopant concentration of 5×1018-5×1020 cm3, with a layer thickness greater than 2 microns, wherein said layers follow one another in the sequence mentioned, each comprising a GaAs compound. The n+-layer or the p+-layer is formed as the substrate and a lower side of the n−-layer is materially bonded with an upper side of the n+-layer, and a doped intermediate layer is arranged between the n−-layer and the p+-layer and materially bonded with an upper side and a lower side.