Invention Grant
- Patent Title: Folded termination with internal field plate
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Application No.: US15774286Application Date: 2016-09-17
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Publication No.: US10340332B2Publication Date: 2019-07-02
- Inventor: Min Ren , Yumeng Zhang , Cong Di , Jingzhi Xiong , Zehong Li , Jinping Zhang , Wei Gao , Bo Zhang
- Applicant: University of Electronic Science and Technology of China , Institute of Electronic and Information Engineering of UESTC in Guangdong
- Applicant Address: CN Chengdu CN Dongguan
- Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA,INSTITUTE OF ELECTRONIC AND INFORMATION ENGINEERING OF UESTC IN GUANGDONG
- Current Assignee: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA,INSTITUTE OF ELECTRONIC AND INFORMATION ENGINEERING OF UESTC IN GUANGDONG
- Current Assignee Address: CN Chengdu CN Dongguan
- Agent Gokalp Bayramoglu
- International Application: PCT/CN2016/099163 WO 20160917
- International Announcement: WO2018/049640 WO 20180322
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/40
Abstract:
A junction termination with an internal field plate, the field plate structure and the junction termination extension region are folded inside the device to make full use of the thickness of the drift region in the body, thereby reducing the area of the termination and relieving the electric field concentration at the end of the PN junction. The breakdown position is transferred from the surface into the body of the original PN junction, and the withstand voltage of termination can reach to the breakdown voltage of the parallel plane junction. Under such design, a smaller area can be obtained than that of the conventional structure at the same withstand voltage.
Public/Granted literature
- US20190067415A1 Folded Termination with Internal Field Plate Public/Granted day:2019-02-28
Information query
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