Invention Grant
- Patent Title: Substrate having embedded electronic component
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Application No.: US15789021Application Date: 2017-10-20
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Publication No.: US10340234B2Publication Date: 2019-07-02
- Inventor: Hong In Kim , Thomas A Kim , Tae Sung Jeong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2017-0039386 20170328
- Main IPC: H01L23/13
- IPC: H01L23/13 ; H01L23/31 ; H01L23/66 ; H01L23/538 ; H01Q1/22 ; H01Q9/27 ; H01L21/56 ; H01L21/48 ; H01L23/367
Abstract:
Disclosed are substrates having an electronic component, including a frame having a through hole, the electronic component disposed in the through hole, a first wiring portion formed on a surface of the frame and the electronic component, a first layer formed on the first wiring portion, and a second wiring portion formed on the first layer, and the second wiring portion including an antenna layer.
Public/Granted literature
- US20180286822A1 SUBSTRATE HAVING EMBEDDED ELECTRONIC COMPONENT Public/Granted day:2018-10-04
Information query
IPC分类:
